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IMAPS Nordic 2003 Conference
Preliminary Programme
Dipoli Congress Center & Helsinki University of Technology, Espoo, Finland, 21 – 24
September 2003
Sunday 21 September, Radisson SAS Hotel, Espoo
| 0900 - 1300 |
Tutorial 1 |
Virtual Reliability Qualification and Reliability Assessment of Microelectronics - Towards short-time-to-market and cost reduction |
G. Q. Zhang, Technical University of Eindhoven and Philips Centre of Industrial Technology,
The Netherlands |
| 0900 - 1300 |
Cancelled:
Tutorial 2 |
Thin Chip Preparation, Separation, Handling and Assembly as
Well as an Outlook on Flexible Systems
Integration |
Karlheinz Bock, Fraunhofer Institute for Reliability and Microintegration
(IZM), Germany |
| 1400 -1800 |
Tutorial 3 |
Design, Optimization, Process and Analysis of RF-Modules in
LTCC |
Peter Uhlig, Jürgen Kassner, IMST, Germany |
| 1400 -1800 |
Tutorial 4 |
Ambient Intelligence and Embedding Components - Application
Viewpoints |
Kieran Delaney, NMRC, Ireland |
| 1600 - 1900 |
Registration |
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| 1930 – 2130 |
Cocktail Party for all |
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Monday 22 September, Dipoli Congress Center, Hall 1
| 0800 - 1830 |
Registration |
Dipoli Congress Center
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| 0900 - 1030 |
MA1 |
Opening Session, Keynotes |
Paul Collander |
| Impact of Lead-free Materials on Manufacturing and Reliability of
Electronics |
Jorma Kivilahti |
Helsinki University of Technology, Finland |
| Ambient Intelligence - The Challenges for
Packaging and
Reliability |
G. Q. Zhang |
Technical University of Eindhoven, The Netherlands |
| Exhibitors' Presentations |
one single minute each |
|
| 1030 – 1100 |
Coffee |
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| 1100 - 1230 |
MA2 |
Ambient Intelligence and Its Realisation |
Mats Lindgren, Maja Gravad |
| Systems Integration and Packaging Requirements for Ambient Intelligence |
Kieran Delaney, John Barton, Stephen Bellis, Cian O’Mathuna |
NMRC, Ireland |
| Ambient Intelligence, the IT Boom of this Decade? |
Esko Strömmer |
VTT, Finland |
| Implementing Ultra Thin Autonomous Modules for Ambient System Applications Using 3D Packaging Techniques |
Bivragh Majeed, Kieran Delaney, John Barton, Joe O’Brien, Ann-Marie Kelleher and Cian
O’Mathuna |
NMRC, Ireland |
| 1030 – 1100 |
Coffee |
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| 1230 - 1330 |
Lunch |
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| 1330 - 1530 |
MP1 |
High Frequency Packaging |
Maja Gravad, Dag Ausen |
| Future Architectures for Communication and Sensor Modules up to 50 GHz -Technologies, Applications and
Experience |
Martin Oppermann |
EADS, Germany |
| Design Capabilities and Microwave Performance of Thin Film on LTCC |
Jens Müller, Dieter Schwanke, Thomas Haas, Ernst
Feuer*, Bernhard Schweizer**, Andreas Klaassen** |
Micro Systems Engineering GmbH & Co., *Reinhardt
Microtech AG, **EADS Deutschland GmbH, Germany |
| Micro-Via in Thin High Frequency
Laminate |
Niklas Billström, Johan Sandwall |
Ericsson Microwave Systems AB, Sweden |
| Highly Integrated Power Distribution Networks on Multilayer LTCC for Ka-band Multiple-Beam Phased Array
Antennas |
J. Kassner, R. Kulke, P. Uhlig, M. Rittweger, P.
Waldow, R. Münnich*, H. Thust* |
IMST GmbH *Ilmenau Technical University Germany
|
| 1530 – 1630 |
Coffee |
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|
| 1630 -1800 |
MP2 |
Multilayer Ceramics LTCC |
Hans Danielsson, Terho Kutilainen |
| Detailed Design Flow for RF LTCC Modules
Using Off the Shelf EDA Packages |
Chris Barratt, Sylvain Gerbier |
National Semiconductor Corp., France |
| Cost Optimisation Strategies for
Multilayer Ceramic Technology RF Modules |
George Passiopoulos |
University College London (UCL), UK |
| Integrated Millimeter-Wave Band-Pass
Filters in LTCC Modules |
M. Lahti, T. Jaakola, V. Kondratyev |
VTT Electronics, Finland |
| 1810 - 1840 |
|
IMAPS Nordic Annual Meeting |
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| 1900 - 2100 |
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Buffet dinner in Exhibition |
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Tuesday 23 September, Dipoli Congress Center, Hall 1
| 0830 - 1000 |
TA1 |
High Density Packaging |
Dag Vinge, Kenneth Dahlberg |
| Development of High Density and
High Frequency Substrate |
S. Kuramochi, M. Akazawa, K. Nakayama, M.
Yamaguchi, A. Takano, Y. Fukuoka* |
Dai Nippon Printing Co. ltd, *Weisti, Japan |
| Thermo-mechanical Reliability of Stacked 3-D SiP |
Jani Miettinen, Eero O. Ristolainen |
Tampere University of Technology Finland |
| Design and Manufacturing of Integrated Modules for Wireless and RF Applications using Multi-Mix Microtechnology
and Green Tape LTCC
Materials |
James J. Logothetis, Daniel I. Amey*, Timothy P. Mobley* |
Merrimac Industries Inc., *DuPont Microcircuit Materials, USA |
| 1000 - 1100 |
Coffee |
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| 1100 - 1230 |
TA2
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Enabling miniaturization |
Dag Ausen, Mats Lindgren |
| Package Miniaturization Options and Challenges for Baseband
ICs
|
Kauppi Kujala, Mervi Kulojärvi
|
Nokia Mobile Phones, Finland |
| New Equipment Concepts for 300mm Wafer
Bumping
|
Joachim Kloeser, Thomas Oppert |
EKRA Eduard Kraft GmbH, Germany |
| Automated Bonding Equipment for
Ultra-Thin Die
Handling |
Peter Wiedner, Christoph Scheiring |
Datacon Semiconductor Equipment GmbH, Austria |
| 1230 - 1330 |
Lunch |
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| 1330 - 1500 |
TP1 |
Embedded components |
Kenneth Dahlberg, Søren Nørlyng |
| Integrated Component Technologies - Opportunities,
Economics and
Trends |
Søren Nørlyng |
Micronsult, Denmark |
| Integrating Wave-Guide
Systems on Printed Wiring
Boards |
Joni Hietala, Esa Muukkonen |
Asperation Oy – Aspocomp Perlos, Finland |
| Embedding Active Components Inside Organic Substrate using IMB
Technology |
Petteri Palm, Risto Tuominen |
Imbera Electronics, Finland |
| 1500 - 1530 |
Coffee |
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1530 - 1700 |
TP2 |
Production and Business Trends |
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Increasing Output with Area Based Placement Optimization |
Timo Liukkonen, Aulis Tuominen* |
Nokia Mobile Phones, *Tampere University of Technology,
Pori, Finland |
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Chip-Scale Packaging for Highly Integrated RF Modules |
Catherine de
Villeneuve |
Tessera, Inc., USA |
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China’s Advanced Packaging Trends and Infrastructure Development |
E. Jan
Vardaman |
TechSearch International, Inc., USA |
| 1930 |
Banquet Dinner |
Dipoli Congress Center |
|
Wednesday 24 September, Helsinki University of Technology Hall E, HUT
| 0830 - 1030 |
WA1 |
Reliability Issues |
Maja Gravad, Søren Nørlyng |
Effect of Recrystallization and Grain Growth on the Reliability of Cu-Cu Wire Bonds
|
Petar Ratchev, Myriam Van De Peer, Hong Meng Ho, Hugo Bender, Ingrid De Wolf,
Bert Verlinden*
|
IMEC, *Katholieke Universiteit Leuven, Belgium |
| Delamination and Solder Flow-out in Underfilled and
Pb-free Flip Chips on Laminate |
Marc van Kleef, Jeroen Bielen |
Philips Semiconductors - Mobile Communications, The Netherlands |
| Reliability of Some Ceramic Components and the Related Effect on System Performance |
Olli Salmela, Klas Andersson*, Jussi Särkkä**, Markku
Tammenmaa**
|
Nokia Networks Espoo, *Nokia Research
Center, **Nokia Networks Oulu, Finland |
| Interconnection Reliability of
Some Lead Free RF-Components in Leadless Packages |
Jussi Särkkä, Klas Andersson, Olli
Salmela, Markku Tammenmaa |
Nokia Corporation, Finland |
| 1030 - 1100 |
Coffee |
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| 1100 - 1230 |
WA2 |
Microelectronics R&D collaboration |
Paul Collander |
| From Research to Industrial Utilization |
A panel discussion about networking in Microelectronics and Packaging in Northern Europe |
|
| 1240 - 1250 |
Closing session |
Where Next? |
Paul Collander |
| 1300 - 1400 |
Excursion for interested to HUT EPT
Microelectronics |
Register before Tuesday |
Jorma Kivilahti |
| 1400 - 1630 |
Tutorial 5 |
Lead-Free Electronics – Materials, Assembly and
Reliability
Box lunch included, Seminar Room, HUT
|
Toni Mattila, Tomi Laurila, Jorma
Kivilahti, EPT, HUT |
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