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Call for abstracts
IMAPS Nordic Conference 2003

Espoo, Finland, 21 - 24 September 2003

IMAPS Nordic is proud to announce the location of this year’s conference: Dipoli Congress Center at Helsinki University of Technology Campus, Espoo. Ensure an outstanding programme and your participation - submit an abstract now!

You are welcome to submit an abstract to the IMAPS Nordic Conference 2003. The abstract must be non-commercial and submitted in electronic form no later than 10 April 2003. Speakers will be notified of paper acceptance by email by 31 May 2003. The deadline for the final paper is 10 July 2003.


Proposed topics include:
  • Microelectronics applications
  • Microvia, HDI laminates 
  • Known Good Die, MCM 
  • Reliability assessment 
  • Multilayer ceramics 
  • Pb and halogen free electronics, methods and consequences 
  • MEMS, MOEMS, sensor integration 
  • Very thin and stacked dies, 3D 
  • Trends in telecommunications and automotive 

 
  • Assessing environmental impact
  • Unique materials, encapsulation, and underfills
  • CSP, flip chips, area array 
  • Future electronics, strategies, and R&D
  • Advanced interconnect
  • System cost assessment
  • Integrated passives and System in Package (SiP)
  • High frequency packaging
  • Break-through achievements in the Nordic countries

Tutorial suggestions are also welcome by email. 

For the latest information about the conference and the exhibition, visit our homepage at http://www.imapsnordic.org or send email to the exhibition host. 

 
2005-06-11   IMAPS Nordic start page   Webmaster