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Tutorial 1 
Optoelectronics (4h)

Dr. Ken Gilleo
Cookson Electronics
25 Forbes Blvd.
Foxboro, MA 02035
kgilleo@cooksonelectronics.com  
www.cooksonelectronics.com  

Level: Introductory – Intermediate
Duration: 1/2-day

This new tutorial surveys OptoElectronics (OE) with a focus on telecommunications. Internet architecture, physical structure and hardware are overviewed to explain where OE plays critical roles. A short review of relevant optical principles is given before covering OE devices and optical fiber. No optics background is required.

Next, OE devices and components are described that includes lasers, amplifiers, optical fibers, filters, signal conditioners, multiplexers/demultiplexers, switches/routers, receivers, modules and related systems. Clear diagrams show functions, mechanisms and principles (some with animations). Emerging technology is discussed and includes tunable lasers and MEMS automatic optical path aligners. Optical MEMS, or MOEMS, is surveyed as part of all-optical switching with animations and videos.

Packaging is thoroughly covered because it is a critical issue and major cost factor. We begin with the traditional full-hermetic package (butterfly) and move to near-hermetic packaging (NHP). Emerging concepts is freely discussed, including the latest 0-Level ideas; Cap-on-Chip, and other wafer-level packaging (WLP) approaches. Plastic packages, formed from high-barrier Liquid Crystal Polymer (LCP) are included. Several packaging concept models are presented for discussions and to generate ideas. 

We will also look at assembly issues, including fiber fusion vs. connectors and embedded waveguides with “free space” package-to-board optical links. A summary of the state of automation includes videos of equipment. We end by discussing the state of Optoelectronics, how it must change, and suggest approaches that can liberate this technology to a much more successful status.

About the Instructor

Dr. Ken Gilleo is an inventor, writer, magazine columnist, packaging specialist and materials scientist with over 30 years of industrial experience that includes hands-on work with flexible printed circuits, flip chip, CSPs, general packaging, MEMS and OE. He holds over 50 US and hundreds of international patents, has made more than 400 presentations and authored 3 technical books with a 4th in progress. Ken is General Technologist for Cookson Electronics and presently works on MEMS and OE packaging.

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Tutorial 2 
Electronic Packaging Reliability

Horatio Quinones
Chief Scientist
Asymtek Headquarters
Carlsbad, CA 92008-6603 USA
Ph: +1 760-930-3374
Fax: +1 760-930-7430
hquinone@asymtek.com

Flip Chip, WLP and CSP Technology:

• A Historic Perspective
• Flip Chip on: ceramics, organic, carriers
• Flip Chip on board, DCA
• Flip Chip encapsulation: 
  • Reliability improvement
  • Failure Mechanisms
  • Accelerated Thermal Cycle data
• Underfill processes for FC

Encapsulation Methods

• Capillary Underfill
• Injection Molding
• Compression flow underfill, “No-flow Underfill”
• Wafer Level Encapsulation

Reliability Statistic

• Data Analysis
• Ring Statistics and T/V design
• Green Cycles
• Reliability Projections electronic packages in the presence of Random Environments: 
  • Random temperature cycles
  • Random frequency of events
• Statistics of Crack Initiation and Propagation, SCRIP statistics  

About the Instructor

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MEMS & MOEMS Tutorial (4h)

Dr. Ken Gilleo
Cookson Electronics
25 Forbes Blvd.
Foxboro, MA 02035
kgilleo@cooksonelectronics.com
www.cooksonelectronics.com

Level: Introductory – Intermediate
Duration: 1/2-day

This new tutorial surveys MEMS and includes the latest developments and applications. The first section overviews materials and fabrication methods. Next, the numerous actuation mechanisms are compared and discussed with recommendations for applications. We will thoroughly examine the role that MEMS is beginning to play in almost every industry. Applications and case histories include: telecommunications (especially RF-MEMS, microphones, MOEMS optical switches, and fiber aligners), automotive, computers, entertainment (games, cinema), aerospace, military, sensors, biotechnology, anti-theft, anti-terrorism, Energy-MEMS (turbines, generators and extractors) and equipment monitoring. Optical MEMS topics will cover MOEMS for telecom and display, including the growing area of digital cinema. We’ll also look at markets and growth potentials for this “healthy” and successful technology.

Packaging is thoroughly discussed because there are still many unresolved issues and there is need for true innovation. We start with the traditional hermetic package (butterfly) and move to near-hermetic packaging (NHP). Emerging concepts include the latest 0-Level ideas; Cap-on-Chip, and other wafer-level packaging (WLP) approaches. New packages are just now moving into production and are described with diagrams and photographs. New plastic packages, including epoxies and advanced Liquid Crystal Polymer (LCP) are included. Wafer-level packaging (WLP) schemes will be covered, especially capping concepts. Assembly and handling of MEMS packages is provided with guidelines.

About the Instructor

Dr. Ken Gilleo is an inventor, writer, magazine columnist, packaging specialist and materials scientist with over 30 years of industrial experience that includes hands-on work with flexible printed circuits, flip chip, CSPs, general packaging, MEMS and OE. He holds over 50 US and hundreds of international patents, has made more than 400 presentations and authored 3 technical books with a 4th in progress. Ken is General Technologist for Cookson Electronics and presently works on MEMS and OE packaging.

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