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IMAPS Nordic 2002 Conference
Final Programme 

Globe Hotel, Stockholm, Sweden, 29 September - 2 October 2002

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Sunday 29 September 

1400 - 1800 Tutorial 1 Optoelectronics; Devices, Modules, Board Assembly and Applications  Ken Gilleo, Cookson Electronics
1600 - 1900  Registration     
1930 – 2130  Cocktail Party for all    

Monday 30 September 

0800 - 1830 Registration     
0930 – 1230 Workshop on microelectronics R&D management   
1030 – 1100  Coffee    
0900 - 1230 Tutorial 2 Electronic Packaging Reliability Horatio Quinones
1230 - 1330 Lunch     
1330 - 1530 MP1  Opening Session Paul Collander, Nokia Networks
  Opening of the Conference   Paul Collander, Karel Kurzweil, IMAPS Europe
  Keynote Blue box technologies - a vision of Electronic Packaging and Production research at the end of the decade  Kåre Gustafsson, Ericsson
    SOC, SIP, and SOP: The Pros and Cons for Next-generation Convergent Systems Rao Tummala, PRC, GeorgiaTech
    Assembly and Reliability of 3-D System-in-Package (SiP) Eero Ristolainen, Tampere University of Technology
  Exhibitors' Presentations One single minute each  
1530 – 1615 Coffee     
1615 - 1755 MP2  Flip Chip Processes Katarina Boustedt, Ericsson; Jan Vardaman, TechSearch
Chip-on-flex  -  The trends and possibilities in packaging Søren Nørlyng Micronsult
A Thermode Bonding Process for Fine Pitch Flip Chip Applications on Flexible Substrates Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner*, Herbert Reichl* Technical University of Berlin, *Fraunhofer Institute of Reliability and Microintegration IZM
The Effect Of The Chemistry And The Filler Content Of Capillary Flow Underfill Encapsulants On The Flow Behaviour, The Thermomechanical Parameters And The Dielectric Properties At High Frequency  Tony Winster, G. Luyckx Emerson & Cuming
Bump & Assembly Technologies For Sub-100 Micron Pitch Flip Chip  Charles E. Bauer, Wu Fei Jain*, Alexandre Taran* TechLead, *Chipbond Technology Corporation
1630 -1730 Poster Session Brief oral presentations  Paul Collander
Actual Development in the Czech Electronics Sector  Ivan Szendiuch  University of Technology in Brno
Point-to-Multipoint Transceiver in LTCC for 26 GHz Reinhard Kulke, G. Möllenbeck, W. Simon, A. Lauer, M. Rittweger IMST GmbH
Novel Stripline Coupler for Multilayer Ceramic Integrated Circuit (MCIC) applications Sarmad Al-Taei, George Passiopoulos Nokia Networks
Microwave Circuits in Multilayer ORMOCER Thin Film Christian Johansson Linköping Institute of Technology
Dispensing adhesive in narrow pattern using a multi-nozzle inkjet head W. Voit, M. Alsered*, K. V. Rao**, W. Zapka** XaarJet AB, *MA Kapslingsteknik AB, **Royal Institute of Technology
Concurrent Thermal and Electrical Analysis of Integral Resistors H. Yu, D. Burlacu, J. K. Kivilahti Helsinki University of Technology
Connectionless Test (CT) using Electromagnetic Signature Mahnaz Salamati, Dag Stranneby Örebro University
1800 - 1830   IMAPS Nordic Annual Meeting Paul Collander
1900 - 2100   Buffet dinner in Exhibition    

Tuesday 1 October 

0800 - 0940 TA1  RF and Microwave Packaging Paul Collander, Nokia Networks, Peter Barnwell, Heraeus
A Novel Flip Chip Approach For Microwave/High Speed Data Chip Packaging Tong Chen 
 Teledyne Technologies, Inc.
The RF & Reliability Performance Ratifications of Suspended Ground Planes for BGA type LTCC Modules  George Passiopoulos, Kevin Lamacraft Nokia Networks
RF Benchmark up to 40 GHz for various low loss LTCC tapes Reinhard Kulke, W. Simon, C. Günner, G. Möllenbeck, D. Köther, M. Rittweger  IMST GmbH
Lumped and distributed element design for LTCC radio filters Jens Müller, Claude Guichaoua*  Micro Systems Engineering GmbH, *Solectron Brittany
0940 – 1030 Coffee      
1030 - 1300 TA2 System Packaging Maja A. Gravad, GN Resound, Karel Kurzweil, IMAPS Europe
µZ-F™ System-in-Package - The Next Generation Multiple Die Package Solution Vern Solberg 
 Tessera Technologies, Inc.
Multi Substrate Modules – Cheap Solution for 3D Packaging  Ivan Szendiuch, Josef Sandera, Jaromír Bílek  University of Technology in Brno
Wafer Bonding Technologies for MEMS Packaging Katrin Persson, Sofie Bohman, Katarina Boustedt*, Dag Stranneby*  Imego, *Örebro University
Packaging at the Wafer Level: Worldwide Trends and Applications E. Jan Vardaman  TechSearch
Jetting Technology for Microelectronics  Horatio Quinones, Alec Babiarz, Christian Deck, Lian Fang  Asymtek 
The First 147 Years of OptoElectronics Ken Gilleo Cookson Electronics
1300 - 1400 Lunch       
1400 – 1515 TP1 Reliability assessment Hans Danielsson, Mikroelektronik Konsult,  Kenneth Dahlberg, St. Jude Medical
Novel Packages and Packaging Technologies for Use in Harsh Environments Peter Frisk, Kristina Hagelin, Mats Lindgren Kitron Development AB
On the Selection of Die-attach Materials for High Temperature Electronics  Frøydis Oldervoll, Morten Berg, Jon Nysæther, Frode Strisland  SINTEF
A Characterisation of Plastic Core Solder Balls for BGA and Flip Chip Applications Matthias Klein, Hermann Oppermann, Steffen Behnke, Rolf Aschenbrenner, Herbert Reichl  Fraunhofer Institute of Reliability and Microintegration IZM Berlin
1515 - 1600 Coffee         
1600 - 1805 TP2  Pb-free and Other Environmental Issues Dag Ausen, SINTEF, Ken Gilleo, Cookson Electronics  
Outlining Opportunities of Engineering Processes and Technology on Environmental Impacts of the End of Life Treatment of Mobile Terminals Roope Takala, Pia Tanskanen Nokia Research Center
Results of Life Cycle Assessments of EEE Using Generic Models for Products and Components  C. Herrmann, P. Eyerer  IKP
Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy  Liley Ye, Z. H. Lai, J. Liu, A. Thölén Chalmers University of Technology
Effect of PWB Coatings on the Reliability of Pb-free CSP Assembly T. Mattila, J. K.Kivilahti Helsinki University of Technology
Anisotropically Conductive Adhesive: An Alternative for Soldering of Small Size Components in Volume Production  Jarmo Määttänen, Petteri Palm, Pasi Perttula Elcoteq
1930  Banquet Dinner     Transportation by bus

Wednesday 2 October 

0800 - 1005 WA1 Advanced board technologies Søren Nørlyng, Micronsult, Ivan Szendiuch, University of Brno
Implementation of solid metal bump interconnection technology for high density interconnection and thermal management  Martin Valfridsson 
 Clover Electronics Co., Ltd.
The Importance of Characterization Parameters in Galvanic Process of PCB Manufacturing  Teija Uusluoto, Paavo Jalonen*, Lenita Koskinen, Aulis Tuominen  Pori School of Technology and Economics,*Satakunta Polytechnic
Manufacturing of Flexible Integrated Module Boards T.F. Waris, J. K. Kivilahti Helsinki University of Technology
Status and future of HDI PWBs Tarja Rapala-Virtanen Aspocomp
The Characterisation of Integrated RF Passive Components in LTCC Antti Vimpari  VTT
1005 – 1035  Coffee          
1035 - 1240 WA2  Ceramic high performance materials Terho Kutilainen, Asperation, Jens Müller, MSE
Properties of High Definition Photoimaged Conductors in LTCC Kari Kautio  VTT
Photoimageable Thick Film Implementation of Very High Density Ceramic Tehnology Products  Valentinas Baltrusaitis, Jurate Minalgiene  Hibridas JSC
Generic investigation on 0-shrinkage processed LTCC  Michael Hintz, Heiko Thust, Erich Polzer* Ilmenau Technical University, *DuPont
HeraLockTM 2000 Self-constrained LTCC Tape - Benefits and Applications  Peter Barnwell, Edmar Amaya, Frans Lautzenhiser, James Wood Heraeus
The development of a new system of materials for AlN substrates Y.L. Wang, A. F. Carroll, J.D. Smith, Y. Cho, R. J. Bacher, D. K. Anderson, J. C. Crumpton, C. R. S. Needes, J. Cocker, J. Ferguson, G. Vanrietvelde  DuPont I-Technologies
1240 - 1250  Closing session    Paul Collander
1300 - 1400  Lunch (included)       
1400 - 1800 Tutorial 3 MEMS, MOEMS and RF MEMS
 Ken Gilleo, Cookson Electronics
1400 - 1630
 Sponsored seminar Critical Aspects in Die Assemblies and LTCC Technology Mark McClintick, Mike Ehlert, National Semiconductors

 

 
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