|
IMAPS Nordic 2004 Conference
Preliminary Programme
Hotel Marienlyst
Helsingør, Denmark
26 – 28 September 2004
Sunday 26 September
Monday 27 September
| 08:00 – 18:30 |
Registration |
|
|
| 09:45 – 12:00 |
MA1 Opening Session |
Paul Collander |
|
| 09:50 - 10:10 |
Keynote 1 |
The Global Microelectronics Industry - A
Challenge for IMAPS! |
Peter Barnwell, Business Development
Director, Custom Interconnect Ltd, UK and First Past President IMAPS
North America |
| 10:10 - 10:50 |
Keynote 2 |
NETPACK Visions Lab – Visions,
Presentations, Opinions, Facts and Challenges Related to Future
Microelectronic Packaging |
Mats Robertsson, ACREO, Sweden |
| 10:50 - 11:30 |
Keynote 3 |
Through the Micro-Interconnects, Taiwan
Links Herself to the World |
Sebastian, Shyi-Ching Liau, Electronic
Research & Service Organization (ERSO)/ Industrial Technology Research
Institute (ITRI), Taiwan |
| 11:30 - 12:00 |
Exhibitors' presentations |
one single minute each |
|
|
|
|
|
| 12:00 – 12:30 |
IMAPS Nordic Annual Meeting |
for members |
|
|
|
|
|
| 12:30 – 13:30 |
Lunch |
|
|
|
MPA1: 3D Interconnect |
|
|
MPB1: Pb Free |
|
Chair: Katarina Boustedt |
|
|
Chair: Hans Danielsson |
13:40 –
14:05 |
Stacked Die vs. Stacked Packages:
Worldwide Drivers and Trends
J. Vardaman, TechSearch, USA |
|
13:40 –
14:05 |
Some New Results from Investigation of
Lead-Free Solders Application
I. Szendiuch et al, Brno University of Technology, Czech Republic |
14:05 –
14:30 |
Industrial Manufacturing of Ultra Small
Form Factor Packaging for Hearing Aids
J. Skindhøj, A. E. Petersen, Oticon, S. Ringgaard Jensen, K. Simoni
Jørgensen, DancoTech, Denmark |
|
14:05 –
14:30 |
Promoting the Commercial Adoption of
Lead-Free Solder and Evaluating its Reliability
K. Suyama, ESPEC CORP. Europe Office, Germany |
14:30 –
14:55 |
Development of Silicon Through
Integration Platform
S. Kuramochi, K. Nakamura, T. Maruyama, M. Akazawa, K. Nakayama, T.
Mori, M. Yamaguchi, K. Suzuki, Y. Fukuoka1, Dai Nippon Printing
Co., Ltd, 1Weisti (Worldwide Electronic Integrated Substrate Technology
Inc), Japan |
|
14:30 –
14:55 |
Study of Component Self-Alignment During
Reflow Using Sn/Pb and Sn/Ag/Cu Solders
M. Arra, D. Geiger, D. Shangguan, Flextronics International |
14:55 –
15:20 |
3D Package Innovations Enable System Level
Integration and Miniaturization
V. Solberg, Tessera, Inc., USA |
|
|
|
|
Coffee |
|
MPA2: Anisotropic Conductive Adhesives |
|
|
MPB2: RF and Ceramics |
|
Chair: Søren Nørlyng |
|
|
Chair: Paul Collander |
| |
|
|
15:45 –
16:10 |
Antenna Integration on LTCC Radar Module
for Automotive Applications at 24 GHz
S. Holzwarth, R. Kulke, J. Kassner, P. Uhlig, IMST GmbH, Germany |
16:10 –
16:35 |
Recent Advances of Interconnection
Technologies using Anisotropic Conductive Films in Flat Panel Display
and Semiconductor Packaging Applications
I. Watanabe, N. Nakazawa, T. Fujinawa, M. Arifuku, M. Fujii, Y.
Gotoh, Advanced Interconnect Material Business Unit, Hitachi Chemical
Co., Ltd., Japan |
|
16:10 –
16:35 |
Prospects and limits of LTCC technology
J. Lenkkeri, T. Jaakola, K. Kautio, M. Lahti, VTT Electronics; P.
Collander, Digipolis, Finland |
16:35 –
17:00 |
Anisotropic Conductive Adhesives for High
Current Density Packaging
M. Jin Yim, KAIST, Korea, J. Gu Kim, Telephus, Ltd., H. Joon Kim, K. Wook Paik,
KAIST, Korea |
|
16:35 –
17:00 |
RF Module Architectures and Technology
Drivers
M. Oppermann, EADS Deutschland GmbH, Germany |
|
|
MPB3: Power |
|
|
Chair: Terho Kutilainen |
17:00 –
17:25 |
Characterisation of Electrical and
Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic
Conductive Adhesive
H. Kristiansen1, 2, T. O.
Grønlund1, J. Liu2,
1Conpart, Norway,
2Division of Electronics Production,
Chalmers University of Technology, Sweden |
|
17:00 –
17:25 |
Modelling of Thermal Aspects of Power
Electronic Assemblies
M. Poech, Fraunhofer-ISIT, Germany |
17:25 –
17:50 |
The Deformation Characterization of
Conductive Particles in Anisotropically Conductive Adhesive Using FEM
Y. Wang1, G. Chen1, J. Liu2,
1State Key Laboratory for Advanced Metals and Materials,
University of Science and Technology Beijing, China, 2SMIT
Center, Division of Electronics Production, Chalmers University of
Technology and IVF, Sweden |
|
17:25 –
17:50 |
“ShowerPower”, Concept for Liquid Cooling
K. Olesen, R. Eisele, Danfoss Silicon Power GmbH, Germany |
17:50 –
18:15 |
High-Density Interconnections in Mobile
Phones Using ACF
P. Savolainen, I. Saarinen, Nokia Corporation |
|
17:50 –
18:15 |
Recent Developments of DBC Substrates for
Higher Resolution Requirements
J. Schulz-Harder, A. Rogg, K. Exel, Curamik Electronics GmbH,
Germany |
| 19:30 – |
Banquet Dinner |
Tuesday 28 September
|
TAA1: Embedded Electronics |
|
|
TAB1: Applications |
|
Chair: Kenneth Dahlberg |
|
|
Chair: Dag Ausen |
09:00 –
09:25 |
Polymeric Carbon Embedded Resistors in
Multilayer Printed Wiring Boards
K. Perälä1, T. Rapala-Virtanen1, Teija
Uusluoto2, A. Tuominen2
1Aspocomp Group, Salo, Finland 2Tampere
University of Technology, Finland |
|
09:00 –
09:25 |
Process Integration of Patterned Getter
Films in Vacuum Wafer Bonding
W. Reinert, G. Longoni, M. Moraja, Fraunhofer-ISIT, Germany |
09:25 –
09:50 |
Embedded Passives Yield Management and
Tradeoffs
C. Palesko, Answer Systems, USA, K. Perälä, Aspocomp Group, Finland
|
|
09:25 –
09:50 |
MyraniteTM for Electronics
Encapsulation and Electro-Magnetic Compatibility (EMC)
N. Sinnadurai, ATTAC, UK |
| 09:50 – 10:45 |
Coffee |
|
TAA2: Embedded Electronics |
|
|
TAB2: Improved Reliability |
|
Chair: Kenneth Dahlberg |
|
|
Chair: Nihal Sinnadurai |
10:45 –
11:10 |
Advanced Manufacturing Technology
For Embedding Active Components Inside Organic Substrate
P. Palm, R. Tuominen, Imbera Electronics Oy, Finland |
|
10:45 –
11:10 |
Plasma Treatment for the Underfill Process
in Flip Chip Packaging
U. Meyer, J. Zhao, J. Getty, March Plasma Systems, SS Too, AMD, USA |
11:10 –
11:35 |
Buried Components in Printed Circuit
Boards
A. Ostmann1, A. Neumann2 , P. Sommer1,
H. Reichl2, 1Fraunhofer Institute for
Reliability and Microintegration (IZM), 2Technical
University of Berlin (TUB), Germany |
|
11:10 –
11:35 |
The Effect of Humidity on Reliability of
Flip Chip Joints on Flexible LCP and PI Substrates
L. Frisk, E. Ristolainen, Institute of Electronics, Tampere
University of Technology, Finland |
11:35 –
12:00 |
Cost Effective SiP Solution for the RF
Wireless Applications
S.-C. Liau, Electronic Research & Service Organization (ERSO)/
Industrial Technology Research Institute (ITRI), Taiwan |
|
11:35 –
12:00 |
Different Ways to Improve the Reliability
of Ceramic Components Soldered to Organic Substrates as FR-4
H. Danielsson, Mikroelektronik Konsult AB, Sweden |
| 12:00 – 13:00 |
Lunch |
| |
TPA1: High Density Interconnect and
Printed Board Assembly |
|
|
TPB1: Production Methods |
| |
Chair: Vern Sohlberg |
|
|
Chair: Dag Vinge |
13:00 –
13:25 |
Characteristic of FVSS (Free Via Stacked
up Structure) for the Solution of Design Subject
M. Takahashi, T. Hattori, T. Nakamura, H. Yanagisawa, IBIDEN
CO.,LTD , PWB Division , Mobile Business Unit, Japan |
|
13:00 –
13:25 |
Jet Dispensing Technology Enablement of
Bump Reinforcement Using Pre-applied Underfill
H. Quinones, R. Hoffman, Asymtek Headquarters, USA |
13:25 –
13:50 |
Interconnect Solutions and Material Trends
in Future Printed Circuit boards
H. Stahr, G. Leising, AT&S, Austria |
|
13:25 –
13:50 |
ECPR (Electro Chemical Pattern
Replication) – a Low Cost Replication Process for Advanced
Metallization
P. Möller, M. Fredenberg, P. Wiwen-Nilsson, L. Karlsson,
Replisaurus Technologies AB, Sweden |
13:50 –
14:15 |
Future Electronics Assembly Trends and
Resulting Assembly Equipment Requirements
G. Schiebel, Siemens AG, Germany |
|
13:50 –
14:15 |
Czech Electronics Sector and Education
I. Szendiuch, Brno University of Technology, Faculty of Electrical
Engineering and Communication, Department of Microelectronics, Czech
Republic |
| 14:15 – 15:15 |
Coffee |
| |
TPA2: High Density Interconnect and
Printed Board Assembly |
|
|
TPB2: Ambient Intelligence |
| |
Chair: Jørgen Skindhøj |
|
|
Chair: Petri Savolainen |
15:15 –
15:40 |
The Evolution of Surface Finishes in
Mobile Phone Applications.
C. Würtz Nielsen, Nokia Mobile Phones R&D, Denmark |
|
15:15 –
15:40 |
Ambient Intelligence Today and Tomorrow
Paul Collander, Poltronic and Digipolis, Finland |
15:40 –
16:05 |
Alternative Assembly Methods for Lead-Free
Solder Eutectic Flip Chips on FR-4 Substrates
D. A. Geiger, J. Sjoberg, D. Shangguan, Flextronics, USA |
|
15:40 –
16:05 |
MULLE: A Minimal Sensor Networking Device
– Implementation and Manufacturing Challenges
J. Johansson, M. Völker, J. Eliasson, P. Lindgren, J. Delsing,
EISLAB, Luleå University of Technology, Sweden |
16:05 –
16:30 |
A Single Package Solution For On-Board
High Performance Optical Receivers
E. Muukkonen, J. Hietala
Asperation Oy, Finland |
|
16:05 –
16:30 |
Low Cost RF Solution for Home Automation
T. Jørgensen, Zensys A/S, Denmark |
| 16:35 – 16:45 |
Closing |
|
|
